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APEC 2015 part III

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You can find more product information introduced at APEC 2015 from Part I and Part II.

Zentrum Mikroelektronik Dresden (ZMDI) introduced the ZSPM1000 and ZSPM1005 digital single-phase PWM controllers for PoL applications that offers fault monitoring and handling, is configurable via the PMBus or pin-straps. The company also offers the ZSPM2000 controller with an integrated MOSFET driver with single-phase PWM controller with an integrated driver for PoL needs. Next, they introduced the ZSPM90xx DrMOS family with an integrated driver and MOSFET power stage for synchronous dc/dc switching regulators. It is based on Intel® 4.0 DrMOS standard. More info at http://www.zmdi.com/

Vishay Intertechnology introduced a new TrenchFET 20-V n-channel MOSFET designed to save space, decrease power consumption, and extend battery usage in wearable devices, smartphones, tablets, and solid-state drives. Offered in a chipscale MICRO FOOT package with a 0.54-mm maximum height, the Si8410DB provides the industry's lowest on-resistance for any 20 V device in the compact 1 mm square footprint. Optimized for use as a load switch, small-signal switch, and high-speed switch in power management applications, the Si8410DB features low on-resistance of 37 mΩ at 4.5 V, 41 mΩ at 2.5 V, 47 mΩ at 1.8 V, and 68 mΩ at 1.5 V. Compared with the closest competing devices in the CSP 1-mm square package, these ratings represent an improvement of 26% at 4.5 V, 32% at 2.5 V, 35% at 1.8 V, and 27% at 1.5 V. Compared with devices in the DFN 1-mm square package, on-resistance is 32% lower at 4.5 V, 40% lower at 2.5 V, 48% lower at 1.8 V, and 43% lower at 1.5 V.

Transphorm announced engineering samples of the TPH3205WS transistor, the first 600-V GaN (Gallium Nitride) transistor in a TO-247 package. Offering 63 mOhm R(on) and 34 A ratings, the device uses the company’s Quiet Tab source-tab connection design, which reduces EMI at high dv/dt to enable low switching loss and high-speed operation in power supply and inverter applications. This new device extends the company’s EZ-GaN product portfolio to now support PV inverter designs with power levels ranging from a few 100 W (micro-inverters) to several kilowatts (residential central inverters). Additionally, they displayed a static demo of the TPH3205WS used in a 3-kW inverter showing test results at 100 kHz and a peak efficiency of 98.8%, and over 99% at 50 kHz. One live demo featured a 2.4 kW, bridgeless totem-pole PFC exhibiting near 99% PFC efficiency at 100 kHz operation. The totem-pole PFC, when combined with a GaN-based dc-dc conversion stage, enables a greatly simplified 80 PLUS titanium power supply design providing power densities unachievable with Si-based designs.

GaN Systems now offers GaN power semiconductors with topside cooling for simpler PCB design that target inverters, UPS, HEVs/EVs, high voltage dc/dc conversion and consumer products such as TVs. These power transistors are based on its proprietary Island Technology – the die consist of islands rather than traditional fingers, which brings significant advantages in terms of better current handling, lower inductance, scaling, isolation and thermal management, as well as enabling smaller die and lowering cost. The enhancement-mode devices with current ratings ranging from 8 to 250 A are delivered in the company’s proprietary GaNPX packaging: the die is embedded within a laminate construction and a series of galvanic processes replace conventional techniques such as clips, wire bonds and molding compounds.  These near-chipscale high power switching transistors are now packaged to be cooled via the topside of the chip using a heat sink or fan – conventional techniques that are well-understood and familiar to design engineers who may be unfamiliar with using GaN devices or using them for the first time. Get more information at www.gansystems.com  

Intersil introduced the ISL8272M, the industry’s first 50 A encapsulated digital dc/dc PMBus power module. It is a step-down power supply that delivers up to 50 A of output current from industry standard 12- or 5-V input power rails. Four modules can be combined to support up to 200 A rails. It provides point-of load conversions for advanced FPGAs, ASICs, processors and memory in space-constrained and power-dense telecom and datacom applications. The device is also well suited for high-end instrumentation, industrial and medical equipment. The complexity and performance of the latest FPGAs and processors used in wired, wireless and cloud computing systems is driving up the number of voltage rails. For example, some optical transmission systems have as many as 60 power supplies on a single board. This complexity requires a higher level of system intelligence and advanced digital power management, including telemetry and system monitoring, to ensure 99.999% uptime. There are real economic impacts when a telecom system or a router goes down. For example, online purchases from Internet retailers can be lost during transmission, making uptime critical. It features digital control technology that provides precise sequencing and system monitoring through the PMBus interface. Get more information at www.intersil.com/products/isl8272m

Vicor let attendees at APEC 2015 to participate in hands-on demonstrations of Vicor’s online PowerBench design tool suite. The tools enable designers to employ a web-based power component design methodology that eliminates design complexity, reduces development costs, and accelerates time to market. The company also showed the latest enhancements to its PowerBench Whiteboard, a design tool that equips users to architect end-to-end power chain block diagrams and dynamically analyze system attributes including efficiency and power loss. With the most recent enhancements to the Whiteboard design tool, users will be able to preview the mechanical layout of their power chains and assess the real-world size and dimensions of the components they’ve selected. Providing a top-down view of the complete component power chain, this capability enables users to better optimize their designs for maximum power density and space savings.

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