200-ball BGA socket has same footprint as IC

The Giga-snap SFS-BGA200B-52 socket allows an 11 x 14.5-mm, 200-ball BGA IC with a 0.65-mm pitch, 12 x 22-array to be placed in a socket with the same footprint as the IC to avoid compromising performance in high-speed applications. The entire unit consists of a patented female BGA socket (with BeCu pins) that mates with a male pin adapter; the user attaches a BGA IC to the adapter, which is then plugged into the female BGA socket that has been soldered onto a pc board. Very little insertion and extraction force is needed.

The RoHS-compliant socket is soldered to the board using standard soldering methods; warping is avoided because the BGA socket and adapter are constructed with high-temperature polyimide and FR-4 body that match pc board materials and, thus, prevent mismatched coefficients of thermal expansion. The electrical path has a length from the top connection point on the male adapter to the solder ball on the female socket of only 3 mm, thus supporting transmission of signals up to 20 GHz with just −1-dB insertion loss. Operating temperature range is −55 to 160°C and current rating is 3 A per pin. Pricing is $276 ea. in single quantities, with reduced pricing for higher quantities. Different pin counts/pitches and custom designs are also available with fast turnaround.