3D IC Development Needs Innovative Socket Solution

Evolution from cell phones with only a base-band processor and limited memory to today's high-end phones with an additional applications processor and memory has driven the industry to 3-D packaging solutions. 3-D packaging can be achieved via die stacking in one package, package-in-a-package stacking or package on package stacking. Each method has its pros and cons. Package on package stacking, which has been researched in a variety of formats, enables stacking of packages from different suppliers and mixed IC technologies. It also allows for burn-in and testing prior to stacking.