The MediSpec Molded Interconnect Device (MID) 3D circuit capability uses Laser Directed Structuring (LDS) technology to integrate electrical and mechanical design into a single molded device for miniaturization. The capability is scalable from small- to large-volume production quantities and produces interconnects that are said to meet or exceed stringent medical device guidelines, reduce component count and materials usage, minimize development and production processes, lower prototyping costs, and deliver faster time to market.
The MID design configurations and material combination options allow medical device designers the flexibility to select plating and materials for such small-form-factor applications as blood glucose meters, drug delivery systems, home healthcare telemetry, remote patient-monitoring systems, disposable catheter interfaces, neuro-stimulation controllers, pulse oximeter sensors, continuous positive airway pressure (CPAP) devices, and integrated RFID solutions. (Contact company for price and availability.)
By Carolyn Mathas
Molex , Lisle , IL
Sales 800-786-6539
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