The 15 mil alumina substrates and 10 mil copper FET ridge are brazed onto the 25 mil carrier using AuGe preform. The GaAs FETs are attached to the Cu ridge using AuSn preform. All capacitors are attached using AuSn preforms. The flanges are designed to accommodate 0-80 UNF-2A socket or Fillister head screws on .400 center-to-center hole spacing. The modules are mechanically and electrically designed to be cascaded.
Source: MwT
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