65-nm ASICs target
embedded, high-performance apps
Chips feature 30 times lower leakage current, or 20% higher performance over previous versions
The Cu-65LP and Cu-65HP ASIC families use a 65-nm process with strained silicon enhancement. With leakage currents as low as 1/30 that of the 90-nm previous version, the Cu-65LP series is appropriate for the ever-more-sophisticated functions found in battery-powered products. The Cu-65HP series targets high-speed applications with a performance increase of as much as 20%.
The 65-nm parts can pack nearly twice as many circuits on a die compared with the equivalent 90-nm offering, reducing high-volume costs. Both families offer an increased focus on power management and first-pass design success using integrated noise, power, timing methodologies, voltage island techniques, a multiple-threshold-voltage library enabling a balance of performance and power, and advanced statistical techniques. (Contact Sales for pricing�design kit available 2nd qtr, prod qty 1st and 3rd qtr, 2007.)
IBM Microelectronics
White Plains, NY
Sales 949-752-1090
http://www.ibm.com/chips
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