IDC assemblies meet high-density needs
Insulation displacement connector assemblies are available in spacings
for standard and high-density assemblies. The FCSD Series socket strips
mate with terminal strips (FCMD Series) on 0.050 x 0.100-in. centers. They
have a dual-beam beryllium copper contact for a gas-tight connection. The
assemblies are available in 5 to 50 positions per row. A 2-mm IDC
assembly, the TCSD Series, stands just 0.200 in. high above the pc board.
It is available with 3 to 25 positions per row and mates with both
through-hole and surface-mount strips. For 0.100-in. spacing, IDC
assemblies come in two mating versions. The HCSX socket and HCMX male
header have assembled heights of 0.375 and 0.310 in., respectively. The
IDSX socket and IDMX header are supplied with the exact number of
customer-specified positions up to 36 per row, for tight spacing in
low-profile applications. (price–avail.) Samtec, Inc., New Albany, IN
Pam Grieb 800-SAMTEC-9 Fax 812-948-5047
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