Tool speeds interconnect analysis by 10 times
Version 1.2 of the Maxwell Spicelink signal integrity design software
includes field solvers that can increase the speed of electrical
characterization by a factor of ten or more over previous versions. The
software also includes automatic Spice model generation for structures
with multiple sources and sinks; 3-D ac analysis including skin effect and
induced eddy currents; and a fast planar solver that can import DXF files
of single-layer planar structures. ($49,500–available now.)
Ansoft Corp., Pittsburgh, PA
Keith Franz
412-261-3200
Fax 412-471-9427
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