Engineers at Infineon Technologies (Munich, Germany) have successfully tested an advanced memory buffer (AMB) test chip for next-generation server modules using DDR2 DRAM.
512MB To 4GB FB-DIMM Modules For Server Applications
With the ever increasing operation frequency, the number of DIMM modules on a memory channel with the current parallel stub-bus interface has hit saturation point. For server applications where lots of DRAM components are required, a new solution replacing the registered DIMM modules for data rates of 533 Mbits/s and above becomes necessary.
The next-generation server platform will have substantial improvements in the memory architecture offering:
- Improved Productivity
- Longevity
- Built in Reliability
Infineon’s Fully Buffered DIMM is the next generation memory module using a new interconnect technology for all server segments and eventually premium desktops.
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