A line of high-frequency center-probe RF test sockets can be used with CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices in speeds of more than 10 GHz with pitches as low as 0.40 mm. Solderless, pressure-mount compression spring probes facilitate termination to and removal from a PCB.
The socket’s gold-over-nickel plated compression spring probes leave very small witness marks on the bottom of the device solder balls. Operating temperature is range is from –55°C to 150°C and estimated contact life is more than 500,000 cycles. (50-lead socket, from $500 ea/10—20 days ARO.)
Aries Electronics , Frenchtown , NJ
Frank Folmsbee 908-996-6841
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