MicroSMP devices save space

With a junction-to-lead thermal resistance of 30°C/W for Schottky rectifiers and 20°C/W for TVS devices, a family of power semiconductors uses the 0.65 x 2.50 x 1.30-mm MicroSMP package for a high-current power density and low thermal resistance in space-challenged applications. The six Schottky rectifiers available are rated up to 1 A at a 110C lead temperature, while the two voltage suppressors have a peak pulse current of 100 W at a 10/1,000-µs waveform.

All devices offer a 25-A forward surge current capability for an 8.3-ms pulse. The devices’ single-chip surface-mount MicroSMP package features solder pads that are compatible with other SMD devices, so no modification is needed to the PCB layout. (From $0.025 ea/1,000—stock to 8 weeks ARO.)

Vishay Intertechnology , Malvern , PA
Information 619-336-0860

http://www.vishay.com