The BCM2044S Bluetooth 2.0 headset IC uses a ROM-based architecture to implement unique noise and echo reduction algorithms, enhancing audio quality without adding additional components. The technology potentially reduces BOM cost by 40%, enabling OEMs to offer high-performance audio capability headsets at the same cost as basic units.
The chip features best in class RF performance and uses an ARM7TDMI processor. It comes in a 6 x 6-mm FBGA package, is footprint compatible with its predecessor, and has a complete reference design available. ($5 ea/100,000samples available now.)
Broadcom , Irvine , CA
Sales 949-926-5000
http://www.broadcom.com
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