Fairchild Semiconductor’s MicroFET™ Power Switches in SC-75 Packaging Lower Thermal Resistance and RDS(ON) in Portable Applications

Fairchild Semiconductor's MicroFET™ Power Switches in SC-75 Packaging Lower Thermal Resistance and RDS(ON) in Portable Applications

Fairchild Semiconductor (NYSE: FCS) releases the FDMJ1023PZ and the FDFMJ2P023Z MicroFET power switches for low power (less than 30V) applications such as charging, asynchronous DC/DC and load switching. These power switches operate with gate voltages as low as 1.5V while offering 75 percent lower RDS(ON) and 66 percent lower thermal resistance compared to other solutions.

The advantage of these 2.0mm x 1.6mm MicroFET power switches is that they can deliver equivalent thermal and electrical performance of power switches packaged in 3mm X 3mm SSOT-6 packaging. Optimal performance in an ultra-compact package is pivotal for portable applications such as cell phones, digital cameras and games where more and more functions are packed into smaller and smaller PCB space. These applications can also benefit from their guaranteed operation down to 1.5V.

Key Features of the FDMJ1023PZ and FDFMJ2P023Z:

* Space savings because these MicroFET power switches are 20 percent smaller than power switches in SC-70 packaging.

* Guaranteed operation down to 1.5V addressing the voltage needs of portable applications.

* Excellent electrical and thermal performance.