As designs get faster, more tightly packed, and generate more heat, current thermal management solutions like fans, heat sinks, and water cooling may encounter logistical or performance problems due to size, weight, efficiency, and reliability issues. The ability for cooling, and heating efforts to be as efficient and unassuming as possible is paramount.
Manufactured using semiconductor-processing techniques, the eTEC miniature thin-film embedded thermoelectric component is the industry’s first device to enable the seamless embedding of an active cooling/heating device in close proximity to the die of an IC. The part functions as a miniature heat pump by pumping heat from IC hot spots to a heat spreader, all from a 0.3 x 0.3 x 0.1-mm size.
Nextreme , Research Triangle Park , NC
Information 919-990-8300
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