Tiny thermoelectric module boosts heat-pumping density

Tiny thermoelectric module boosts heat-pumping density

Addresses latest thermal management needs of electronic components

Microscopic in size, the UPF OptoCooler ultrahigh packing fraction module is the industry’s first thermoelectric device to offer a heat-pumping density in excess of 70 W/cm2 , representing a 10-fold increase in heat-pumping capacity over conventional TEC modules. The module addresses the latest thermal-management requirements for optoelectronics, medical, military, and aerospace applications—enabling, for example, direct cooling of a laser diode on a scale that is similar to the diode itself.

The thermoelectric module removes a maximum of 420 mW of heat at 25C ambient in an active footprint of only 0.55 mm2 . As a result, the module can pump a heat density up to 78 W/cm2 . At 85°C, these values increase to 610 mW and 112 W/cm2 , respectively.

The device features the company’s thin-film thermal bump technology and can be integrated directly into electronic and optoelectronic packaging. In addition, the module provides a millisecond response time and broad temperature-range capabilities. ($12 ea/1,000—available now.)

Nextreme , Research Triangle Park , NC
Karl von Gunten 919-316-3562

http://www.nextreme.com