TI introduces industry’s most highly integrated transmit processor for wireless basestations

TI introduces industry's most highly integrated transmit processor for wireless basestations

TI introduced a single-chip wireless transmit processor that combines digital upconverter (DUC), crest factor reduction (CFR), and digital pre-distortion (DPD) linearization functions.

Advanced linearization functions on a single chip enable OEMs to achieve power efficiencies beyond 40 percent

The GC5322 device increases the efficiency of multi-carrier power amplifiers (PAs) in the RF transmit signal chain and eliminates the need for more costly high-performance RF power amplifier components. This enables basestation OEMs to achieve power efficiencies of 25 percent or more for Class AB PAs and reaching 40 percent or more for Doherty PAs.

Increased subscriber demand for wireless service, within limited licensed RF spectrum, has forced base station OEMs to adopt wideband, complex, spectrally efficient modulation schemes to increase voice and data capacity over cellular networks. These signals are more sensitive to distortion. As a result, multi-carrier PAs operate well below saturation, where they are much less efficient. RF systems engineers must compensate for this reduced efficiency by utilizing more expensive components in the RF power amplifier subsystem design.