TOSHIBA BRINGS NEW IMAGE SENSORS AND CAMERA MODULES TO MOBILE HANDSET MARKET

TOSHIBA BRINGS NEW IMAGE SENSORS AND CAMERA MODULES TO MOBILE HANDSET MARKET

Three New Image Sensors and Two New Chip Scale Camera Modules Help Mobile Handset and Notebook Computer OEMs Implement High-Quality Digital Cameras in Compact Designs

Download Larger Image (JPG 488KB)

SAN JOSE , Calif., April 1, 2008 — Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced a significant addition to its line of products supporting mobile handset digital cameras and integrated cameras for mobile notebook computers, including three new Dynastron® image sensors based on Toshiba’s high-sensitivity pixel technology and two new chip scale camera modules (CSCM) that provide significant reductions in size to allow OEMs to incorporate high-resolution digital cameras in next-generation mobile handset designs. These new sensors and camera modules complement two mobile handset peripheral chips also announced by Toshiba this week and highlight TAEC’s commitment to supporting the North American mobile handset market.

“In order to accommodate the development of handsets with more robust functionality and increasingly sleeker and smaller form factors, OEMs need access to components that provide high-performance in a small package,” said Andrew Burt, vice president of the Imaging and Communications Marketing Group in the ASSP Business Unit at TAEC. “With these new image sensors and camera modules, Toshiba is providing customers with digital camera solutions at the component and system levels that allow them to address today’s handset design trends and deliver the kinds of mobile phones consumers want.” The three image sensors announced today are all implemented in Toshiba’s 1.75-micron pixel technology. These sensors include a 2-megapixel (MP) SoC sensor (1/5-inch optical format), a 3 MP SoC sensor (1/4-inch optical format) and 5 MP CIS sensor (1/3-inch optical format). All three sensors have been designed to provide superior performance in low light operating conditions.

Backed by Toshiba’s through chip via technology to allow mounting and assembly of camera components in the chip wafer during manufacturing, the two additions to Toshiba’s family of CSCMs announced today offer compelling savings in overall module size, yielding a smaller design footprint. The two CSCMs include one with a 2MP SoC (optical format 1/5-inch) and one with a 3MP SoC (optical format 1/4-inch). Both of the new CSCMs feature an integrated image signal processing function to give the CSCMs more digital still capture-type functionality in small form factors. Backed by Toshiba’s comprehensive image and color calibration tools, these CSCMs are easily configurable, providing a rapid time-to-market advantage.

Pricing and Availability

The 2 MP SoC sensor (1/5-inch optical format) is priced at $10 per unit, the 3 MP SoC sensor (1/4-inch optical format) at $15 per unit and the 5 MP CIS sensor (1/3-inch optical format) $20 per unit, all 10K quantities. All sensors and CSCMs are sampling now. Contact TAEC at imagesensors@taec.toshiba.com for pricing information for the CSCMs.

About Toshiba’s Mobile Strategic Initiative

Toshiba’s Mobile Strategic Initiative, announced in 2007, combines an expanded product portfolio, support tools (reference designs and evaluation boards) and the company’s cooperation with baseband, application processor, I/O and core vendors to help TAEC customers address tough issues facing current and future mobile handset/portable consumer electronics designs, including system integration, emerging standards and interoperability. Additionally, TAEC provides local application and design-in support and access to a host of analog peripheral ICs from other Toshiba divisions and business units, including the Toshiba Dynastron CMOS image sensor family, LCD drivers, memory products and LCD modules.

*About TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, distributions and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, discrete devices, displays, advanced materials, medical tubes, custom SoCs/ASICs, digital multimedia and imaging products, microcontrollers and wireless components that make possible today’s leading cell phones, MP3 players, cameras, medical devices, automotive electronics and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan ‘s largest semiconductor manufacturer and the world’s third largest semiconductor manufacturer (Gartner, 2007 WW Semiconductor Revenue Estimate, Dec. 2007). For additional company and product information, please visit http://www.toshiba.com/taec/.

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba’s “Handling Guide for Semiconductor Devices,” or “Toshiba Semiconductor Reliability Handbook.” This information is available at chips.toshiba.com or from your TAEC representative. Dynastron is a registered trademark of Toshiba Corp. in certain jurisdictions.