Standard-package IGBTs feature low chip temp

Standard-package IGBTs feature low chip temp

The NX series IGBT modules offer a new package design that provides multiple configuration options, improved manufacturability, reduced development time, and lower cost from previous models. The modules feature high-thermal-conductivity aluminum nitride ceramic to provide heat transfer from the power chips to the heat sink. The result is lower chip temperature (Tj ) and more than tenfold improvement in thermal cycle life from earlier versions.

A common base plate and case shell are used with interchangeable screw terminal box and pin terminals to create single-, dual-, seven-pack-, and converter-inverter-brake circuit configurations ranging from 75 to 600 A at 600 V and 35 to 600 A at 1,200 V with negative-temperature-coefficent thermistor output in a 17-mm thin package. The IGBTs were designed for general-purpose motor drives. ($62 to $177 — available now.)

Powerex , Youngwood , PA
Kelly Bandieramonte 800-451-1415

http://www.pwrx.com