TI introduces complete audio subsystem for portable devices

TI introduces complete audio subsystem for portable devices

Highly integrated device provides efficiency, flexibility, improved sound and reduced size for wireless handsets

DALLAS (Aug. 12, 2008) – Texas Instruments Incorporated (TI) (NYSE:TXN) today introduced an analog-input audio subsystem that integrates TI’s field-proven stereo Class-D power amplifier and stereo DirectPath headphone amplifier into one compact package. The audio subsystem is highly flexible, enabling customers to choose different input-to-output configurations and program design parameters to optimize audio performance. Integrating all amplifier channels into one integrated circuit reduces bill of materials, lowers cost and enables sleeker end designs in wireless handsets, portable DVD players, portable gaming and portable media players. (See www.ti.com/tpa2050d4-pr.)

The TPA2050D4 audio subsystem includes a stereo Class-D amplifier which provides a 1.4-W per channel output drive capability into 8-Ohm loudspeakers with 90 percent efficiency to extend battery life in portable applications. The subsystem also features a low-noise stereo DirectPath headphone amplifier that eliminates the need for DC-blocking output capacitors to reduce component count.

The audio subsystem has two stereo single-ended inputs that can be configured as one stereo differential input to achieve better common-mode noise rejection. In addition, the user can program different gains and modes via a 1.8-V compatible I2C interface. For instance, each input channel has a 32-step volume control with an additional four-level gain control for the headphone amplifier. This allows the headphone volume to differ from the loudspeaker volume if both are used simultaneously, increasing flexibility for the consumer. The voltage limiter on the headphone amplifier help headphone manufacturers prevent hearing damage at high volumes and enable compliance of maximum volume standards.

Pricing and availability

The TPA2050D4 is available in a 2.61 mm x 2.61 mm WCSP package. The audio sub-system is available now, with a suggested resale pricing of $2.30 in 1,000-piece quantities. Samples and EVMs are available from www.ti.com/tpa2050d4.

Extending TI’s portfolio of portable audio solutions

The TPA2050D4 is optimized to work with TI’s broad portfolio for portable devices, including audio codecs (TLV320AIC3104, TLV320AIC33 and TLV320AIC34), digital-to-analog converters (TLV320DAC32, PCM1774), power management and TI’s DSP and OMAPTM processors or other integrated chipsets, such as LoCostoTM devices. Signal chain solutions and the industry’s largest support network enable designers to reach the market quickly. For more information see the Audio Solutions Guide at ti.com/audio.