Ferrite chip beads shrink footprint by 64%

0201-sized multilayer devices optimize noise reduction in cell-phone power circuits

The BKP0603 series multilayer ferrite chip beads are available in an 0201 case size (0.6 x 0.3 x 0.3 mm), offering a 64% smaller footprint than the company’s previous version, the BKP1005 series. Performance and size improvements are attributed to the company’s material science, multilayering, and printing technologies to enable optimize noise-reduction capability in mobile-phone power circuits and other portable battery-powered electronic equipment.

The BKP0603 series is currently available in two versions. The BKP0603 HS220 features an impedance of 22 Ω (100 MHz), an Rdc of 0.065 Ω, and a current rating 1.0 A while the BKP0603 HS330 offers an impedance of 33 Ω, an Rdc of 0.070 Ω, and a 1.0-A rated current. ($0.05 ea/large qty — 2 weeks ARO.)

Taiyo Yuden , Schaumburg , IL
Yaeko Minamikawa 847-925-0888

http://www.yuden.us