PCB attach method challenges BGA for higher-speed applications — Molex

PCB attach method challenges BGA for higher-speed applications — Molex

Standard ball-grid array (BGA) technology was developed as a response to increasing densities required by applications such as high-speed data transfer. Although widely accepted, BGA does have its drawbacks, including solder wicking during reflow, missed connections, coplanarity, voids, and solder bridges.

Solder Charge technology is stepping up to challenge BGA as the standard for SMT adhesion, offering better compliancy, less solder-joint stress, higher yields, improved fatigue strength, and bonds that are three times stronger than traditional BGA. The concept comprises a blanked solder mass that is extruded through a hole near the tip of a terminal until it fills a volume on the pin’s opposite side. Solder Charge uses stamping equipment for adhesion to the terminal — unlike BGA, which is manually placed—to enable precision to 1/10,000-in.

Solder Charge is currently offered in several connectors on the market—including the SeaRay and HDMezz mezzanine devices—and is also available to other connector manufacturers and contract manufacturers to employ in their proprietary processes.

Molex , Lisle , IL
Carol Magosky 630-718-5290

http://www.molex.com/product/smt_ffc-fpc.html