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Power MOSFET features backside insulation

The Si8422DB TrenchFET power MOSFET in the chip-scale microfoot package is optimized for power amplifier, battery, and load switching in portable devices such as cell phones, PDAs, digital cameras, MP3 players, and smart phones. The 2-mil backside coating of the device insulates the top of package to prevent electrical shorts from being created by temporary contact with moving parts in portable devices.

Power MOSFET features backside insulation

The 20-V n-channel MOSFET features a 1.55 x 1.55-mm footprint with a 0.64-mm profile. The device offers a low on-resistance range from 0.043 Ω at 1.8-VGS to 0.037 at 4.5-VGS , with a maximum gate-source voltage of ±18 V.( $0.20 ea/100,000 — available now.)

Vishay Intertechnology , Malvern , PA
Information 619-336-0860

http://www.vishay.com/

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