Epoxy system has low to moderate viscosity

The EP21FL two-part epoxy resin system features low to moderate viscosity and suits bonding, potting, coating, and sealing electronic assemblies. The adhesive’s typical viscosity for Part A is 4,000 cps at 25C and 10,000 cps at 25C for Part B, with a bond strength greater than 1,500 psi and tensile strength over 1,100 psi.

The hardened compound acts an electrical insulator with a volume resistivity greater than 1,012 Ω-cm, is resistant to thermal cycling and shock, and has a temperature range of 60° to 250°F. The resin system is available in half pint, pint, quart, one gallon, and five gallon container kits. (Contact company for pricing and availability.)

Master Bond , Hackensack , NJ
Information 201-343-8983

http:/www.masterbond.com