In this issue:
- Cover Story – Analog & Digital ICs
- Understanding temperature drift in precision DACs
- Debugging software on Cortex-M3 and -M4 devices
- Serial RapidIO Gen2 switching
- Dedicated audio ICs enable next-gen smart phones
- Multi-PHY ICs take home networking to the next level
- Electronic components for a greener world
- Features
- Wire & Cable – 'Flexibility' vs. 'flex life'
- Technology Roundtable – Medical Electronics Forum
- Energy-Saving Initiative Series- Testing for grid-tied solar system inverters
- Product Teardown – What's Inside? iHome Docking System
- Viewpoint
- Product of the Year- Story Behind The Story
- Outlook (Technology News)
- Product Application
- Product Update
- Test & Measurement
- Integrated Circuits
- Design & Development Tools
- Boards & Peripherals
- Components & Subassemblies
- Packaging & Interconnections
- Optoelectronics
- Power Sources
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