The EP21ANHT is a highly thermally conductive, two-component epoxy system designed to relieve thermal issues associated with tightly packed components and miniaturized electronic circuits. The cured epoxy offers a thermal conductivity over 22 BTU/in/ft2 /hr/°F and serviceability in temps from –60° to 400°F.
The system is composed of an adhesive, sealant, and coating with a 1 to 1 mix ratio by weight or volume and is curable at room temperature. The epoxy has an 18 to 20 in./in. x 10-6 /°C coefficient of thermal expansion, a dielectric strength of ≥ 400 V/mil, and a tensile shear strength ≥ 1,000 psi. The system is available in pint, quart, gallon, and 5-gallon kits. (Contact company for pricing and availability.)
Master Bond , Hackensack , NJ
James Brenner 201-343-8983
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