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Mezzanine connectors suit 1386 apps

The 891-10-064-30-120000 male and 893-43-064-30-420000 female 64-position 1-mm-pitch mezzanine connectors are intended for parallel board-stacking interconnections. They meet EIA-700 AAAB specifications for IEEE 1386 applications and can be used as modular connectors for front-panel and backplane I/O cards.

The surface-mount connectors have a mated height of 10 mm. Packaging is tape and reel, per EIA-783. The connectors feature 30-µin. gold-plated contacts and tin-plated solder terminals. The insulator housings are made of high-temperature glass-filled LCP, rated UL 94V-0. (Contact company for price and availability.)

By Carolyn Mathas

Mill-Max , Oyster Bay , NY
Customer Service 516-922-6000
www.mill-max.com

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