Thermal gap filler pad can be removed safely

Thermal gap filler pad can be removed safely

The Sarcon 50G-Hm is a high-performance, low-resistance gap filler pad manufactured with a special top surface that is less sticky than the opposing surface, allowing the thermal pad to adhere to a target electrical component or opposing heat sink. This allows for quick and easy removal without ripping, warping, or damaging the interface material.

The gap filler pad transfers heat with a thermal conductivity of 6.0 W/m°K and a very low thermal resistance of 0.16°C in.2 /W at 72.5 psi. The 0.5-mm-thick flame-retardant TIM is available in sheets up to 300 x 200 mm. (Contact company for price and availability).

By Carolyn Mathas

Fujipoly America , Carteret , NJ
Information 732-969-0100

www.fujipoly.com