Movidius and Toshiba Electronics Europe collaborate on high resolution 3D system solution for smartphones

Movidius and Toshiba Electronics Europe collaborate on high resolution 3D system solution for smartphones

Movidius to demo MA1178’s high quality 3D imaging capabilities at MWC 2012

Dublin, Ireland and Duesseldorf, Germany, 1 February 2012 – Movidius, the mobile multimedia processor company, today announced it has partnered with Toshiba Electronics Europe to develop a complete 3D system solution for the smartphone market.

Movidius’ MA1178 has been combined with Toshiba’s 8 Megapixel EDOF (extended depth of field) cameras to enable 3D camera module manufacturers to deliver a compelling 3D imaging solution, ideally suited to top of the range smartphones. EDOF cameras offer distinct advantages over traditional autofocus in terms of 3D synchronisation.

The Movidius MA1178 Dual ISP and video processor chip seamlessly integrates into the handset’s existing platforms with auto-calibration and configuration functionality to simplify the design process and reduce the cost of manufacture. The Toshiba 8 Megapixel EDOF cameras and the Movidius MA1178 allow a perfect focus matching of stereoscopic images, which leads to superior 3D picture quality. The system solution offers flexibility for customers to implement a symmetric or asymmetric set up of either two 8 Megapixel EDOF cameras or a combination of 8 and 3 Megapixel EDOF cameras.

In the crowded handset market, high quality 3D imaging capabilities offer mobile manufacturers the opportunity to differentiate their offering from their competitors, providing the end user with the best quality HD 3D experience and enjoyment.

“Movidius’ Myriad 3D solution delivers multimedia features beyond what is offered by any other player in the mobile 3D market,” commented Shiro Ando, Vice President, Toshiba Electronics Europe. “Movidius’ leading 3D imaging capabilities complement the high functionality of Toshiba’s EDOF cameras, enabling mobile handset makers to meet consumer demand for a superior 3D mobile experience. Simultaneously, they simplify the manufacturing process by rectifying distortion via software rather than requiring laser trimming during production.”

“The team at Movidius is very excited to be partnering with Toshiba to develop this leading 3D solution,” commented Sean Mitchell, CEO of Movidius. “Customers seeking to differentiate their product in the highly competitive handset market will benefit from Movidius’ innovative and best quality 3D imaging solution as well as Toshiba’s worldwide leading position as EDOF camera supplier to the mobile phone market.”

Movidius will demonstrate its MA1178 product together with the 3D system solution at the MWC 2012 in Barcelona later this month. To secure an appointment with the Movidius team at Booth # 2.1E51 please email pr@movidius.com

www.movidius.com

www.toshiba-components.com

■