Solder barrier sockets prevent contamination

Solder barrier sockets prevent contamination

OFP (organic fibre plug) solder barrier receptacles are discrete sockets for through-hole soldering into printed circuit boards. The open-bottom receptacles are fitted with OFPs to prevent solder, paste, or flux from contaminating the internal contact during the placing and soldering process. When the device/mating lead is plugged into the receptacle, the OFP is knocked out to allow the mating lead to pass through the fingers of the internal contact for a reliable electrical connection.

Fourteen sizes/styles are available, 13 with standard tape-and-reel packaging that permit through-hole components to be placed simultaneously with surface-mount parts on pick-and-place assembly lines. The knock-out-bottom feature reduces the length of the sockets providing advantages. The receptacles can stand upright and stable in a carrier tape pocket, and the protrusion through the PCB is minimal. The parts are available as discrete receptacles and, and can be supplied in bulk or on carrier tape per EIA-481 for industry-standard pick and place machines. (Contact company for pricing — available now.)

By Carolyn Mathas

Mill-Max , Oyster Bay , NY
Customer Service 516-922-6000
www.mill-max.com/PR626