Laird Technologies scientist to present at the IMAPS Advanced Technology Workshop on thermal management

Laird Technologies scientist to present at the IMAPS Advanced Technology Workshop on thermal management

Subject matter expert to discuss benefits of thermally conductive printed circuit boards

St. Louis, Missouri, USA – November 9, 2012 – Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced that Jeff Hershberger, Staff Scientist and Technology Leader for Thermoelectrics, will present at the International Microelectronics and Packaging Society (IMAPS) Advanced Technology Workshop on Thermal Management. The event will take place at the Toll House in Los Gatos, California, November 12-14, 2012.

Scheduled to speak during the Monday evening session, Dr. Hershberger will present on the improved efficiency of thermoelectric coolers (TECs) based on thermally conductive printed circuit boards (TCPCBs) when cooling concentrated heat loads. The presentation will include data from testing the efficiency of TCPCB-based TECs compared to more traditional TECs with aluminum oxide printed circuit boards.

In addition, Dr. Hershberger will present results of testing performed with copper plates between the heat load and the TEC to improve heat spreading. Discussion will center around these results and how to best integrate them into the design of a TCPCB-based TEC. The presentation will last approximately 25 minutes with a question and answer session to follow.

As an industry leader in high-performance and cost-effective Thermal Management Solutions, Laird Technologies provides the knowledge, innovation, and resources to ensure exceptional thermal performance and customer satisfaction for applications in the medical, analytical, telecom, industrial, and consumer markets. For additional information, visit http://www.lairdtech.com

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