Industry’s first 30-A encapsulated power module

Industry’s first 30-A encapsulated power module

The ISL8225M is the industry’s first 30­­­−A encapsulated power module. The power module features the industry’s highest power density and simplifies the design of high-performance board-mounted power solutions. The device features a 4.5 to 20−V input range and 0.6 to 6−V output range.

The ISL8225M power module delivers up to 100−W output power from a 17−mm2 PCB footprint. The module offers two 15−A outputs that may be used independently or combined to deliver a single 30−A output. Current sharing and phase interleaving allow up to six modules to be paralleled for 180−A output capability. The module features 95% efficiency and low thermal resistance permit full power operation without heat sinks or fans. The junction temperature range extends from −40° to +125°C. Three evaluation board versions are available for $15 each. ($48.85 ea/500 — available now.)

By Paul O’Shea

Intersil , Milpitas , CA
Sales 408-432-8888
www.intersil.com