For over 40 years the semiconductor industry has been governed by a commonly known principle described as Moore’s Law. This “law” predicts that through technological advancement a doubling of the number of devices (or gates) per integrated circuit will occur within a given geometric area on regular 18 month intervals. The realization of this doubling effect over time has resulted in an ever-widening range of semiconductor devices exhibiting increases in functionality and processing speed combined with an increased demand for power and effective thermal management. This doubling effect has also driven a matching rapid evolution in IC package types and I/O interface configurations. PC board level processing, with the related interconnection components in the form of IC sockets and adapters, has simultaneously been developed to meet the needs of manufacturers and end-users alike.
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