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Highly crack resistant underfill targets thin flexible circuitry

The  CN-1751-4 reworkable underfill encapsulant is  crack resistant, to withstand flexing experienced by flexible printed circuitry or drops and shocks of very thin printed circuit assemblies. It has a low CTE, 48 ppm/°C for superior thermal cycle performance.  Its viscosity is only 900 cps, so it can flow quickly across large BGA's and POP's. 

incn25_Zymet_CN1751_mar2013

Rework is accomplished by use of elevated temperature, 170° to 180°C, to remove the underfill fillet.  Then, the BGA is lifted from the board after heating it to reflow temperature.  Underfill residue is easily scraped off, again at 170° to 180°C.(Email for pricing and availability)

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