Sil-Pad Selection Guide – Thermally Conductive Interface Materials for Cooling Electronic Assemblies

This is a comprehensive catalog that includes information on most Bergquist thermal interface materials.  Sections include Gap Pad Thermally Conductive Materials, Gap Filler Liquid Dispensable Materials, Thermal Interface Compounds, Hi-Flow Phase Change Interface Materials, Sil-Pad Thermally Conductive Insulators, Bond-Ply and Liqui-Bond Adhesives.