The WinPath4 access packet processor enables mobile operators to scale capacity and eliminate network bottlenecks caused by higher usage and the growing deployment of 4G LTE. The IC targets backhaul networks where LTE will require migration from a Layer 2 centralized hub network to a Layer 3 mesh IP topology with intelligence at each base station.
The IC comes in a 40 x 40 mm FCBGA1517 package and has dedicated hardware accelerators for packet classification, hierarchical shaping, and additional security standards. It takes only 22-35 W maximum and has more than four times the performance of the previous generation. The chip support virtual bonding that bundles fiber, copper, or wireless Ethernet.
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