Over the last 50 years, the NXP logic business – starting as Signetics and then Philips Semiconductors – has supported growing global demand for logic. Today, as the No. 1 volume logic supplier in the world, NXP supports high-volume mobile requirements and offers a broad variety of industry-leading package solutions – all at the exceptionally high levels of quality demanded by top automotive and military customers. We continually invest in new process and package technologies, as well as new packaging facilities, to extend our leading-edge portfolio.
Speed, power, and size
We focus on increasing performance, lowering power consumption, and reducing size. Our advanced CMOS processes deliver robust functionality and drive the expansion of our low-power 1.8- and 3.3-V logic families. All our logic families are characterized and specified from -40 to +125 °C, and our combination and configurable logic families, which let a single device perform many different operations, enable greater design flexibility and simpler inventory management.
Low-voltage solutions (3.3 V and below)
We offer several product families optimized for low-voltage applications. Our AUP family, which operates at just 1.8 V, offers ultra-low power consumption, while the AVC family saves energy in systems operating at 2.5 V. For applications in the 3.3 V range, our advanced LVC, LVT, ALVC, and ALVT families deliver top-level performance and are ideally suited for use in high-end workstations, consumer products, and telecommunications equipment.
High-voltage solutions (5 to18 V)
For improved performance in PCs, consumer applications and portable systems operating at 5 V, we offer the HEF4000, HC/T and AHC/T families which are available in TSSOP to DQFN and PicoGate packages.
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