QFN packages suit devices to 40 GHz

For high frequency applications, Barry Industries' hermetically sealable HTCC Quad-Flat-No-Lead (QFN) packages with air cavity are available in six sizes – 3, 4, 5, 6, 7, and 8 mm – with standard JEDEC MO-220 footprints. They feature broadband low-loss transitions for superior performance over frequency.

Maximum insertion loss is 0.5 dB from dc to 18GHz, 1.5 dB from 18 to 35 GHz, and 4 dB from 35 to 40 GHz. HTCC construction provides for enhanced mechanical strength and higher thermal conductivity compared with LTCC packages. The packages are available with either a plain seal for epoxy or metallized grounded seal ring for solder lid attachment. Lids are available and additional options include castellation and custom pin counts. Standard plating is gold over nickel.