To provide high-performance venting of automotive electronics' housings in a smaller footprint, the AMF200200 PolyVent Compact Series measures just 14.33 mm in diameter by 8.9 mm in total height — 30% smaller than previous PolyVent Snap-Fit products. It aims to provide a higher level of protection for sensitive components like sensors, motors, and control units, while providing reliable and rapid pressure equalization through the use of an enhanced microporous oleophobic membrane that allows airflow but blocks water and contaminants.
The smaller total height provides more flexibility in component layout, and facilitates heat transfer from printed circuit boards to the housing exterior. Low installed height (only 3.45 mm) affords less external protrusion and less vulnerability to mechanical impacts or steam-jets: often, no protective wall is needed.
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