Increased demand for high-speed interconnects

The rapid growth of mobile and cloud computing has fueled access to vast and varying amounts of data stored across public and private networks. For data centers and network equipment operators, the demand for more data is driving a more urgent need for higher speeds across facilities already facing the growing pressure to deliver the most cost-effective service in an increasingly competitive marketplace. In this environment, cloud-based service providers and network equipment manufacturers are looking for more effective data connectivity solutions that allow them to remain competitive by reducing operating costs, improving bandwidth, and lowering power requirements. 

Innovation Market Driver  

Driven by the demand for high-speed access to more information, data centers and network equipment providers face throughput requirements that are quickly escalating to 40 Gbps, 100 Gbps and even beyond 1 Tbps. At these rates, conventional interconnects struggle to maintain signal integrity and electromagnetic compatibility (EMC) performance required in network equipment and data centers. In the past, limitations in interconnect technologies have offered limited options for meeting demand for faster, more reliable data connectivity. Today, advances in signal integrity, thermal design and physical density of high-performance interconnect provides data center architects and network equipment providers with the performance edge needed to deliver massive amounts of data more quickly and more cost-effectively. At the same time, increasingly complex high-performance data connectivity requirements are driving a growing need for tighter collaboration between equipment manufacturers and interconnect providers to understand and meet the unique challenges associated with high-bandwidth interconnect, signal integrity, thermal management and EMI reduction. 

TE Connectivity Products     

TE Connectivity's data connectivity products span the full range of rates and throughput required to meet emerging requirements for high-speed data. From edge connectors to high-speed backplane and midplane interconnects, TE Connectivity products are designed to meet the needs of data centers for high-density board-to-board, wire-to-board and wire-to-wire connectivity. For high-bandwidth data connectivity requirements, the STRADA Whisper backplane family offers high-speed copper connectivity at 25 Gbps scalable to 40 Gbps. As data centers push toward even higher data rates, TE Low-cost Lensed Multi-fiber Interconnect (TELLMI) technology meets the need for terabyte rates for optical backplanes.

TE Connectivity's interconnect product families offer the broad range of configurations needed to optimize thermal performance in dense wire centers and cabinets. At the same time, TE's specialized design methods reduce EMI with features such as improved gasket retention plates and latch plates. Most important, TE Connectivity brings its technology and engineering expertise to bear on each customer's unique challenges, enabling high-speed connectivity products with better signal integrity, improved bandwidth, less heat and lower electronic emissions. 

Benefits of Next Generation Interconnects

Higher speed data, denser bus structures and tighter board geometries bring new challenges for ensuring data throughput and signal data integrity while minimizing heat and EMI. Using new design methods, TE Connectivity engineers continue to create new solutions that pack higher speed and higher density connections in smaller packages. As a result, standard interconnect products such as the STRADA Whisper family deliver next-generation performance in copper interconnect while maintaining premium signal integrity and EMC performance. TE's interconnect solutions continue to meet emerging needs for higher data bandwidth at lower power and in smaller packages. The combination of high-performance interconnect products and a collaborative engineering approach provides network equipment makers and data center architects with a competitive advantage in meeting evolving requirements for data access and storage in a rapidly changing industry. 

Stay Connected

As data center architects and network equipment face growing demand for data throughput, TE Connectivity products and services meet an evolving need for high performance, thermally efficient data connectivity solutions.  

By Stephen Evanczuk