Silicon Interposers with Integrated Passive Devices: Ultra-Miniaturized Solution using 2.5D Packaging Platform

This paper addresses one of the most promising technologies that meets the demand in terms of miniaturization and increased performance. IPDiA has developed a range of silicon interposers which, when combined with Integrated Passive Devices (IPD) and Through Silicon Vias (TSV), offer a new solution to related portable products, implantable medical devices, avionics and defense.