Five times the ESD protection in a flip-chip suits wearables

The SP1012 series TVS diode array is the most densely designed ESD protection device on the market today. It packs five ESD diodes in a 0402-size (0.94 x 0.61-mm) flip-chip package that would normally contain only one. The ESD protection device targets products for the growing wearables and consumer market. With a flip-chip package the silicon itself is the package and the electrical connections are the die itself. It also includes plated leads for solderability. This helps circuit designers economize on both printed circuit board (PCB) space and costs.

These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC61000-4-2 international standard without performance degradation. The bidirectional configuration provides symmetrical ESD protection for data lines when ac signals are present. A single device can protect five lines against an ESD attack, and is suited for use on SIM card interfaces and data lines for capacitive touchscreen displays. www.littelfuse.com