IC Socket- Carrier for Semiconductor Devices in Finished Product

Introduction
Today’s electronic packages have high clock speeds (multi GHz range), fine pin densities (below 0.4 mm pitch) and high pin counts (over 2000). When these packages assembled onto a printed circuit board (PCB), they perform certain functions at certain speed. Socketing is one of the avenues to mount IC packages to PCB semi permanently. Socketing these high-speed and high-density IC packages requires an innovative solution to the challenges of designing a socket with shorter signal path (less resistance), good electrical insulation (prevents signal loss), and proper thermal management. Design of the socket is dictated not only by the functions mentioned above, but also by the other parameters such as durability, power consumption, assembly methods and the environment in which the system will operate over its lifetime.