Socket accepts wafer-level chip-scale package

The SG25-BGA-2016 socket for a 2.76 x 2.76-mm, 0.35-mm-pitch wafer-level chip-scale package (WLCSP) operates at frequencies to 40 GHz with less than 1 dB of insertion loss (GSSG configuration). Network analyzer reflection measurements for the GSSG case were taken with all pins except those under consideration terminated into 50 Ω. Contact resistance is typically 20 mΩ per pin and current capacity is 2 A per pin.

The $289 socket is constructed with a high-performance, low-inductance elastomer contactor and is mounted using supplied hardware on the target PCB with no soldering. It has the smallest footprint in the industry, which allows inductors, resistors, and decoupling capacitors to be placed extremely close to the device for impedance tuning. The socket also incorporates a simple swivel hardware installation method so that IC's can be changed out quickly. Temperature range is −35°C to 100°C, pin self- inductance is 0.06 nH, mutual inductance is 0.019 nH, capacitance to ground is 0.129 pF, and mutual capacitance is 0.017 pF.