Multichip LEDs brighten the road

The OSLON Black Flat LED family is based on UX:3 chip technology — a ThinGaN chip technology that has no metallization on the chip surface to improve current spreading through the LED chip. This generates very high luminous flux, even at high currents. The brightness is emitted from a comparatively smaller package, which makes very compact headlamp designs possible. They are available in configuration from one chip to five chips in a row. Thanks to surface mount technology, all members of this product family can be easily mounted on a printed circuit board and then processed further as part of standard soldering procedures. This soldering capability enables the LED to be integrated in a simple, standardized process and reduces the complexity of the processing steps, which saves considerable time and costs, especially compared to previous multichip LEDs.

The black QFN package expands in a similar way to the circuit board during cyclic temperature loads, meaning that the soldered joints are exposed to much less strain and are significantly stronger. The complete LED family offers greater design freedom for headlight manufacturers. OEMs can choose the most suitable of the existing versions, depending on the design desired. Applications include high-/low-beam automotive headlights, daytime running lights, fog lamps, and working lights. OSRAM Opto Semiconductors: http://www.osram-os.com/osram_os/en/