Designed for 47.5 x 47.5-mm, 1-mm-pitch, 2104-pin BGA ICs such as Xilinx FPGAs, the SG-BGA-6450 high-performance BGA socket operates at bandwidths up to 27 GHz with less than 1-dB insertion loss. The sockets are also designed to dissipate few watts; it uses an aluminum compression screw and can be customized with fins and axial flow fan for higher-power dissipation.
The socket supports 27 GHz on all pins with a typical contact resistance of 20 mΩ per pin. The socket mounts on the target PCB with no soldering, and employs a shoulder screw and a swivel lid that allow ICs to be changed out quickly. Constructed with a high-performance, low-inductance elastomer contactor, the socket comes with ball guide for the precise alignment of BGA balls to PCB pads.
With a temperature range of −35°C to 100°C, the socket has a pin self-inductance of 0.15 nH, mutual inductance of 0.025 nH, capacitance to ground of 0.01 pF, and current capacity of 2 A per pin. Units are priced at $985 in single quantities, with reduced pricing in higher volumes.
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