Trigence Semiconductor has launched the first audio IC module (ICM) based on TDK’s semiconductor embedded substrate (SESUB) packaging technology. It’s an all-in-one audio output solution for incorporation into Digital Speaker Modules (DSMs).
Trigence’s audio ICM significantly reduces footprint requirements for the audio output stage. It can be combined directly onto the electro-mechanics of consumer micro-speakers, turning the speaker into an independent digital component or digital speaker.
It’s a highly integrated system that combines volume control, 11-band audio equalizer, audio DSP, Dnote speaker driver, EMI filter, all passive components, and the latest SoundWire interface for portable audio applications. Trigence’s audio IC module also embeds several signal-processing algorithms to enhance sound quality and loudness without requiring hardware or acoustic design changes.
Take, for instance, the Digital Thiele-Small Parameter Correction (DTSC) technology, which provides the ability to mimic changes in parameters such as diaphragm size or mass. That, in turn, improves acoustic quality of the speaker, earphone, or headphone through real-time digital signal processing.
Then, there is the Digital Assist (D-Assist) algorithm, designed to protect the speaker from damage when driven beyond its typical rated limits. It maintains a preset maximum internal temperature within the speaker cavity, and that prevents over-excursion of the speaker diaphragm. The technique employs an all-digital sensing and control methodology that ensures maximum loudness and protection from the loudspeaker in real time.
Finally, TDK’s SESUB packaging technology utilizes ultrafine materials and processing techniques. It brings numerous advantages, including high-density mounting, package miniaturization, better thermal dissipation, low noise emission, and enhanced design flexibility and inter-chip connection.
Trigence Semiconductor: www.trigence.com
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