Advertisement

Ruggedized circular connectors feature snap-in modules

ITT’s Veam MOVE-MOD ruggedized circular connectors offer a range of snap-in modules for greater design flexibility.

ITT’s connector business has launched its new series of Veam MOVE-MOD ruggedized, modular circular connectors. This new design can deliver power, signal, and data in a single connector by using a range of snap-in modules with various contact layouts to match system requirements. These ruggedized circular connectors, designed for harsh environments, are suited for a range of applications, including rail, heavy and off-road vehicles, alternative energy and infrastructure, robotics, and other industrial equipment.

ITT Veam MOVE-MOD ruggedized circular connectorsThe modularity of the MOVE-MOD connectors give designers more flexibility by enabling to them to swap out modules post-design. Other ease-of-use features include toolless assembly and installation, and an ultra-secure bayonet coupling that features visual, tactile, and audible secondary locking confirmation.

The bayonet coupling with secondary locking and the circular form factor is said to minimize weight and footprint size, and offers a condensed footprint compared to standard rectangular connector equivalents.

The series is available in two ultra-harsh-environment plating options that offer 500-hour salt spray resistance. The first option is the proprietary Blue Generation plating, which is a high-performance zinc-nickel formulation that is conductive and is reported to offer excellent RFI shielding. The second option is a non-conductive Black Hard Anodized plating also for use in extreme environments.

Other features include IP67 environmental sealing, a minimum of 500 mating cycles, and an operating temperature range of -55°C to 115°C. The connectors are RoHS and REACH compliant.

Advertisement



Learn more about ITT Interconnect Solutions

Leave a Reply