Here is this week’s roundup of new products, including an all-silicon 45-watt (W) fast charger reference design. Listed in alphabetical order by company name, this week’s new products roundup also covers digital-to-analog converters, capacitors, fuses, IGBTs, InGaAs photodiodes, memory card controllers, motors, radiation-hardened (rad-hard) ICs, and RF adapters.
Fermionics Opto-Technology has launched its FD80 series of high-speed InGaAs photodiodes. These ultra-compact, low-dark-current, and low-capacitance photodiodes are designed for use in extremely tight spaces, such as high-speed communication systems. The FD80 series features a planar-passivated device structure with an 80-µm diameter active area on a vertical or horizontal-mount S8 ceramic package pigtail assembly in solderable surface-mount configurations. The PIN photodiodes are coupled directly to a single- or multi-mode pigtail fiber. They also are available with an internal fiber tip angle that is polished for low back reflection. Other customizable options are available. Please see the datasheet for absolute maximum ratings, optical and electrical characteristics, and packaging options.
Infineon Technologies AG has introduced two 750-V EDT2 IGBTs in a TO247PLUS package. Expanding the company’s portfolio of discrete high-voltage devices for automotive applications, the devices target automotive discrete traction inverters. These IGBTs meet and exceed AECQ101 for automotive components and the TO247PLUS package offers a greater creepage distance for easy design-in, said Infineon. The EDT2 technology has a breakdown voltage of 750 V, supporting battery voltages up to 470 VDC, and is said to have significantly lower switching and conduction losses. The IGBTs also offer smooth switching performance, low gate charge (Q G) and a high junction temperature (T vjop) of 175°C. The rated currents of the discrete EDT2 IGBTs are 120 A and 200 A at 100°C, each with a very low forward voltage, reducing conduction losses by up to 13 percent compared to the previous generation, according to the company. The AIKQ120N75CP2 and AIKQ200N75CP2 IGBTs are available now.
Hyperstone has introduced its new S9 family of secure digital (SD) and microSD memory card controllers for industrial applications. The S9 NAND flash memory controllers provide FlashXE ECC and hyReliability features that are said to guarantee extended endurance, data integrity, and power fail safety for demanding applications in markets such as industrial automation, telecom, networking, and medical equipment. It incorporates the company’s hyMap flash translation layer for efficient use of 3D NAND flash and the complementary hySMART lifetime and health monitoring tool. A S9S version of the controller with an API adds a variety of security features, supporting AES-128/256, Public Key Elliptic Curve Cryptography, TRNG/DRBG, and SHA-256 hashing as well as GPIO pins and ISO7816, I2C, and SPI interfaces. “The S9 comes with various options to adjust the firmware, add unique code, and attach other external component,” said Hyperstone. The S9 has been qualified for the industrial temperature range (-40°C to 85°C). The S9-LAK08 (standard version) and S9-LASK08 (security and API version) will be available in a 7.5 × 4 mm LGA-64 package. SD cards for evaluation as well as engineering samples and firmware are available now.
Littelfuse Inc. is touting the first automotive-grade 1000-VDC fuse, which is designed for passenger cars and commercial electric vehicles (EVs). The EV1K Series Fuses are tested to meet the overcurrent circuit protection needs of the eMobility market, specifically EV high-voltage power supply applications such as on-board chargers, battery packs, DC/DC converters, traction motor inverters, and auxiliary loads. These fuses, measuring 25 × 73 mm, are rated for 1000 VDC with an interrupting rating of 30,000 A and 60−125 A nominal amperage ratings. The end caps incorporate integrated bolt-down terminals, which are durable against mechanical vibration and shock, said Littelfuse. The operating temperature ranges from -55˚C to 125˚C. They are RoHS compliant, halogen-free, and 100% lead-free. The EV1K series is available in bulk packages of 60 pieces per box. Samples can be ordered via Littelfuse’s authorized distributors. Fuses up to 600 A are under development.
Murata has claimed a new benchmark with the introduction of a three-terminal MLCC with a capacitance of 4.3 µF in a compact 0402 inch (1.0 × 0.5 mm) package size for space-constrained automotive applications where high-performance processors are used such as advanced driver assistance systems (ADAS) and autonomous driving functions. With a three-terminal arrangement, the NFM15HC435D0E3 is said to offer a significantly lower equivalent series inductance (ESL) than would be expected with two-terminal components. This means that stable circuit operation can be supported, while significantly reducing the mounting area required, said Murata. The capacitance rating in the small package is thanks to Murata’s proprietary thin layer forming technology and a high-precision lamination process as well as improvements in ceramic and electrode materials. The device is available in volume production.
Nidec Corp. has claimed its new CA series of linear vibration motors offer the smallest-class diameters in the industry. Vibration motors are used in variety of portable devices such as smartphones, smartwatches, stylus pens, and virtual-reality units such as smart goggles/gloves. The ultra-small CA series was developed, based on larger conventional vibration motors, to meet these applications. The CA series is comprised of three vibration motors, the CA3, CA7-VH5, and CA7-VH9, which are designed for stylus pens. These motors “recreate a tactile sense to make users feel as if they were actually writing on paper,” said Nidec. The CA motors consume 1.3 mW to 6 mW of electricity, which is approximately one-fiftieth of the power consumed by the vibration motors installed in general smartphones, based on a comparison with Nidec’s standard vibration motors. The high efficiency reduces the required battery capacity and helps to reduce its weight.
Pasternack, an Infinite Electronics brand, has expanded its line of high frequency, 1.85-mm, right-angle RF adapters. These devices are used in the military and commercial markets for satcom, wireless communications, test labs, R&D, and other space-constrained applications that require high-frequency coaxial adapters. The 1.85-mm right-angle adapters feature a maximum operating frequency of 67 GHz. They exhibit low VSWR of 1.35 (max) and provide mode-free operation up to 67 GHz. The 50-ohm adapters feature a stainless-steel construction for repeatability and reliability. A key feature of the adapters is that they allow 90-degree turns in spaces that are too small to fit the bending of many coaxial cables, said the company, and can reduce excessive strain on cables used in certain tight-space applications. The adapters are in-stock with no minimum order quantity.
Rohm Semiconductor has introduced its new BD34352EKV digital-to-analog converter IC (DAC) and an evaluation board, the BD34352EKV-EVK-001, for supporting high-resolution sound sources in high-fidelity audio equipment. The BD34352EKV includes an advanced digital filter, which is the same one used for the flagship BD34301EKV DAC chip for Rohm’s MUS-IC series. This delivers “superior numerical performance (S/N ratio: 126 dB, THD+N: -112 dB) of the DAC chip,” said Rohm, making it suited for high-end audio equipment. In addition, the digital filter (FIR filter), a key function of the digital signal processing (DSP) circuit, is designed to process even the smallest signals by achieving a rejection band attenuation of -150 dB or less, which makes it possible to extract the full range of information from sound sources and provide sound quality characteristics that allow listeners to hear more powerful, natural flat sound, said Rohm. The digital filter also can be customized in the DSP circuit with preset, custom, or external setting selections. The DAC chip is priced at $16 each for samples.
Silanna Semiconductor has added an all-silicon 45-W option to its family of fast charger reference designs. The new RD-24 reference design is production-ready, supplying everything needed to prototype and test a functional 45-W 1C charger. The RD-24 provides an (uncased) power density of 23.5 W/inch3 in a single PCB design, and operates with a peak efficiency of above 92% and no-load power consumption of below 20 mW. Efficiency is flat across the universal input voltage range of 90 – 265 VAC, said Silanna. The design is centered around Silanna’s ultra-high-efficiency CO2 Smart Power SZ1131 active clamp flyback (ACF) controller, which is rated for up to 65 W in universal input designs and above 100 W in PFC supported applications. This controller offers a higher level of integration by incorporating an adaptive digital PWM controller, ultra-high-voltage (UHV) active clamp FET, active clamp gate driver, and startup regulator. All of Silanna’s charger designs exceed conducted and radiated EMI requirements from 3 dB to 6 dB to eliminate the need for pre-production validation and certification, said the company. The SZ1131, in a 16-pin SOIC package, offers protection against over-temperature, over-voltage, over-current, over-power, output short circuit, and transformer core saturation faults without the need for additional external components.
STMicroelectronics has introduced a series of radiation-hardened (rad-hard) power, analog, and logic ICs in low-cost plastic packages for “new space” satellites that deliver services such as earth observation and broadband internet from low-Earth orbits (LEOs). The company has released the first nine devices in the series, including a data converter, a voltage regulator, an LVDS transceiver, a line driver, and five logic gates that are used in systems such as power generation and distribution, on-board computers, telemetry star trackers, and transceivers. The series ensures a radiation hardness match to the LEO mission profile, with a total ionization dose immunity up to 50 krad(Si), high immunity to total non-ionizing dose, and single event latch-up (SEL) immunity up to 62.5 MeV.cm²/mg. The parts outgassing is characterized to ensure it stays within the commonly accepted limits of new space applications, said ST. Prices for the new LEO series components range from $70 for logic ICs to $450 for the data converter in orders of 1000 pieces through ST distribution partners. Development model prices range from $135 to $775 for 10 pieces. ST expects to expand the series in the coming months.
Other new products covered this week include the following:
Renesas unveils next-generation R-Car SoC for ADAS and AD
TE launches Nano RF optical modules for military applications
EPC, Analog Devices partner on 2-MHz buck converter reference design
Bioimpedance AFE reduces power consumption and size in RPM devices
High-current inductors save space, reduce EMI
Semtech extends Tri-Edge optical platform for data centers
Here is a link to last week’s product roundup.