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AI camera kit features Qualcomm SoC and Sony sensor

An AI camera kit from e-con Systems features its 4K MIPI camera module with Sony’s STARVIS IMX415 ultra-low-light sensor and Qualcomm’s QCS610 SoC.

Embedded camera company e-con Systems has launched a Qualcomm artificial intelligence (AI) vision kit for running image-based machine-learning (ML) and deep-learning models at the edge. The qSmartAI80_CUQ610 AI camera kit is comprised of e-con’s 4K MIPI low-light camera module, based on the Sony STARVIS IMX415 ultra-low-light sensor, and VVDN Technologies’ system-on-module (SoM), based on the Qualcomm QCS610 SoC, and a carrier board.

The increasing demand for AI-based cameras, including in retail for monitoring and surveillance and automotive applications, is expected to drive market growth. The global AI-based camera market is forecast to reach $16.1 billion by 2027, up from $7.2 billion in 2020, according to an AllTheResearch report.

e-con Systems Qualcomm AI vision kit

Click for a larger image. (Image: e-con Systems)

Qualcomm Technologies, Inc. added the QCS610 SoC to the Qualcomm Vision Intelligence Platform in 2020 to bring premium camera technology, including AI and ML features, to mid-tier camera segments. The new AI Vision kit is e-con’s first camera for the Qualcomm QCS series of processors.

The Sony STARVIS IMX415 sensor delivers clear images even at low light conditions. With its 4K resolution, the sensor is suited for applications that require high-quality images.

The qSmartAI80_CUQ610, developed in partnership with VVDN, an electronics engineering and manufacturing company, is designed to help system engineers develop edge-AI-enabled embedded vision applications with consistent image quality even in challenging light conditions.

The kit delivers powerful computing for on-device image processing and the Qualcomm image signal processor (ISP) has been fine-tuned to ensure the best possible image output, said e-con Systems.

The camera board comes in a small form factor, measuring 30 × 30 mm. It includes three 4-lane MIPI CSI, a 4-lane MIPI DSI, and 4-bit SDIO, as well as USB 3.1, USB 2.0 (Type C) and USB 2.0 (host only) interfaces. Network connectivity support includes Wi-Fi, 2.4 GHz/5 GHz, Bluetooth, and Ethernet.

Customization is available for the camera, carrier board, software, and enclosure. Applications include robotics (service, telemedicine, and telepresence), smart checkouts & carts, smart signage, kiosks, dash and body cameras, and automated sports broadcasting systems.

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