TDK Corp. has released its InvenSense SmartSound T5838 and T5837 MEMS microphones and the SmartSound One Development Platform. The development platform offers a solder-free, plug-and-play interface to develop different types and configurations of microphones, including pulse density modulation (PDM) and analog MEMS microphones.
(Source: TDK)
The T5837 and T5838 PDM MEMS microphones are said to be the lowest power PDM multi-mode MEMS microphone with high acoustic overload point (AOP) of 133 dB SPL, high signal-to-noise ratio (SNR) 68 dBA, and wide dynamic range, which is suited for environments that shift from very quiet to very loud, such as far field voice pickup for smart speaker to ANC TWS applications, said TDK.
Both microphones consume 130 µA in always-on mode and 330 µA in high-performance mode. They are available in small 3.5 × 2.65 × 0.98 mm bottom port packaging.
The T5837 offers multiple modes of operation such as high-quality, low-power (always on), ultrasonic, and sleep mode. High-quality mode offers an SNR of 68 dBA while consuming 310 µA of supply current at 1.8 V. Low-power mode offers an SNR of 65.5 dBA while consuming 120 µA of supply current at 1.8 V. Applications include smartphones, TWS earbuds, tablets, cameras, Bluetooth headsets, smart speakers, notebook PCs, and security and surveillance markets.
The T5838 offers new acoustic activity detect (AAD) features, delivering the same acoustic performance, modes of operation, and low-current consumption as the T5837. AAD is a new ultra-low-power edge processing feature where the microphone monitors the acoustic environment and wakes up the main SoC or application processor out of a deep power down mode when activity is detected, said TDK, which can maximize system battery life.
The AAD is available with three modes of operation starting at 20 µA. It provides user programmability for various filters and thresholds to optimize performance for each application. Target applications include smartphones, TWS earbuds, tablets, cameras, Bluetooth headsets, smart speakers, notebook PCs, security and surveillance markets, high-end voice activated remote controls, and voice-activated equipment.
The SmartSound One USB plug-and-play microphone interface module enables designers to evaluate and develop TDK analog and digital MEMS microphone solutions. It is compatible with PDM digital, I²S digital, single-ended analog, and differential analog TDK microphones supplied on a flexible PCB.
“Users can plug in up to two microphones to transmit high-quality stereo audio using standard audio packets over the USB connection,” said TDK, “and can capture this audio using their favorite software for later playback or detailed real-time analysis.”
TDK Corp. is exhibiting at CES 2023, January 5-8, in Las Vegas, NV.
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